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TDA7580 FM/AM digital IF sampling processor Features FM/AM IF sampling DSP ON-CHIP analogue to digital converter for 10.7MHz IF signal conversion FM channel equalization FM adjacent channel suppression Reception enhancement in multipath condition Stereo decoder and weak signal processing 2 Channel serial audio interface (SAI) with sample rate converter I2C and buffer SPI control interfaces RDS filter, demodulator & decoder Inter processor transport interface for antenna and tuner diversity Front-end AGC feedback of an AM/FM channel. The HW & SW architecture has been devised to perform a digital equalization of the FM/AM channel, and a real rejection of adjacent channels and any other signals, interfering with the listening of the desired station. In severe multiple path conditions, the reception is improved to get high quality audio. LQFP64 Description The TDA7580 is an integrated circuit implementing an advanced mixed analogue and digital solution, to perform the signal processing Table 1. Device summary Part number TDA7580 TDA758013TR Package LQFP64 LQFP64 Packing Tube Tape and reel March 2007 Rev 5 1/39 www.st.com 1 Contents TDA7580 Contents 1 2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block diagram and electrical specifications . . . . . . . . . . . . . . . . . . . . . . 7 2.1 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3 4 5 6 7 8 SAI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 RDS SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 BSPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Inter processor transport interface for antenna diversity . . . . . . . . . . 26 I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 8.12 8.13 8.14 24 bit DSP core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 DSP peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Clock generation unit (CGU) and oscillator . . . . . . . . . . . . . . . . . . . . . . . 29 Stereo decoder (HWSTER) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Serial audio interface (SAI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 I2C interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Serial peripheral interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 High speed serial synchronous interface (HS3I) . . . . . . . . . . . . . . . . . . . 31 Tuner AGC keying DAC (KEYDAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Asynchronous sample rate converter (ASRC) . . . . . . . . . . . . . . . . . . . . . 31 IF band pass analogue to digital converter (IFADC) . . . . . . . . . . . . . 31 Digital down converter (DDC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 RDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 AM/FM Detector (CORDIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9 Application diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 2/39 TDA7580 Contents 9.1 Electrical application scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 10 11 12 Package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 3/39 List of tables TDA7580 List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Recommended DC operating conditions (Tj = -40C to 125C) . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 General interface electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Low voltage interface CMOS DC electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 15 High voltage CMOS interface DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15 Current consumption (Tj =-40C to 125C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Crystal characteristics for 1 and 2 chip load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 External clock signal on XTI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 DSP core (Tj =-40C to 125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FM stereo decoder characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Sample rate converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 SPI and I2C timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SAI Timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 RDS SPI timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 BSPI timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 HS3I timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 I2C BUS timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4/39 TDA7580 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 PIN connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power on and boot sequence using I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Power on and boot sequence using SPI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SAI Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SAI protocol (when: RLRS=0; RREL=0; RCKP=1; RDIR=0) . . . . . . . . . . . . . . . . . . . . . . . 20 SAI protocol (when: RLRS=1; RREL=0; RCKP=1; RDIR=1) . . . . . . . . . . . . . . . . . . . . . . . 21 SAI protocol (when: RLRS=0; RREL=0; RCKP=0; RDIR=0) . . . . . . . . . . . . . . . . . . . . . . . 21 SAI protocol (when: RLRS=0; RREL=1; RCKP=1; RDIR=0) . . . . . . . . . . . . . . . . . . . . . . . 21 RDS SPI timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 RDS SPI clocking scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 BSPI timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 BSPI clocking scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 High speed synchronous serial interface - HS3I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 HS3I clocking scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 DSP and RDS I2C BUS timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Radio mode with external slave audio DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Radio mode with external master audio device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Audio mode with external slave audio device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Application diagram example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Mechanical, data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 5/39 Overview TDA7580 1 Overview The algorithm is self-adaptive, thus it requires no "on-the-field" adjustments after the parameters optimization. The chip embeds a Band Pass Sigma Delta Analogue to Digital Converter for 10.7MHz IF conversion from a "tuner device" (the TDA7515 is highly recommended). The 24bit DSP allows flexibility in the algorithms implementation, thus giving some freedom for customer required features. The total processing power offers a significant headroom for customer's software requirement, even when the channel equalization and the decoding software is running. the program and data memory space can be loaded from an external non volatile memory via I2C or SPI. The oscillator module works with an external 74.1MHz quartz crystal. It has very low electro magnetic interference, as it introduces very low distortion, and in any case harmonics fall outside the radio bandwidth. The companion tuner device receives the reference clock through a differential ended interface, which works off the oscillator module by properly dividing down the master clock frequency. That allows the overall system saving an additional crystal for the tuner. After the IF conversion, the digitized baseband signal passes through the base band processing section, either FM or AM, depending on the listener selection. The FM base band processing comprises of stereo decoder, spike detection and noise blanking. The AM noise blanking is fully software implemented. The internal RDS filter, demodulator and decoder features complete functions to have the output data available through either I2C or SPI interface. No DSP support is needed but at start-up, so that RDS can work in background and in parallel with other DSP processing. This mode (RDS only) allows current consumption saving for low power application modes. An I2C/SPI interface is available for any control and communication with the main micro, as well as RDS data interface. The DSP SPI block embeds a 10 words FIFO for both transmit and receive channels, to lighten the DSP task and frequently respond to the interrupt from the control interface. Serial audio interface (SAI) is the ideal solution for the audio data transfer, both transmit and receive: either master or slave. The flexibility of this module gives a wide choice of different protocols, including I2S. Two fully independent bidirectional data channels, with separate clocks allows the use of TDA7580 as general purpose digital audio processor. A fully asynchronous sample rate converter (ASRC) is available as a peripheral prior to sending audio data out via the SAI, so that internal audio sampling rate (~36kHz and FM/AM mode) can be adapted by upconversion to any external rate. An inter processor transport interface (HS3I, high speed synchronous serial interface) is also available for a modular system which implements Dual Tuner Diversity, thus enhancing the overall system performance. It is about a synchronous serial interface which exchanges data up to the MPX rate. It has been designed to reduce the electro magnetic interference toward the sensitive analogue signal from the tuner. General purpose I/O registers are connected to and controlled by the DSP, by means of memory map. A debug and test interface is available for on chip software debug as well as for internal registers read/write operation. 6/39 TDA7580 Block diagram and electrical specifications 2 Block diagram and electrical specifications Figure 1. Block diagram A/D RDS I2C/SPI I2C/SPI HS3I IF digital Signal processor DAC SAI1 SAI0 CGU Oscillator SRC Table 2. Symbol VDD VDD3 Absolute maximum ratings Parameter Power supplies (1) Nom. 1.8V Nom. 3.3V Value -0.5 to 2.5 -0.5 to 4.0 -0.5 to 4.0 -0.5 to 6.50 -0.5 to 3.80 -0.5 to (VDD+0.5) -0.5 to (VDD3+0.5) -40 to 125 -55 to 150 Unit V V V V V V C C Analog input or output voltage belonging to 3.3V IO ring (VDDSD, VDDOSC) Digital input or output voltage, 5V tolerant All remaining digital input or output voltage Tj Tstg Operating junction temperature range Storage temperature Normal(2) Failsafe(3) Nom. 1.8V Nom. 3.3V 1. VDD3 refers to all of the nominal 3.3V power supplies (VDDH, VOSC, VDDSD). VDD refers to all of the nominal 1.8V power supplies (VDD, VMTR). 2. During Normal Mode operation VDD3 is always available as specified. 3. During Fail-safe Mode operation VDD3 may be not available. Warning: Operation at or beyond these limits may result in permanent damage to the device. Normal operation is not guaranteed at these extremes. 7/39 Block diagram and electrical specifications Table 3. Symbol VDD VDDH VOSC VDDSD VMTR TDA7580 Recommended DC operating conditions (Tj = -40C to 125C) Parameter 1.8V Power supply voltage 3.3V Power supply voltage (1) 3.3V Power supply voltage (1) 3.3V Power supply voltage (1) 1.8V Power supply voltage Comment Core power supply IO Rings power supply (with GNDH) Oscillator power supply (GNDOSC) IF ADC power supply (with GNDSD) DAC keying and tuner clock power supply (with GNDMTR) Min. 1.7 3.15 3.15 3.15 1.7 Typ. 1.80 3.30 3.30 3.30 1.80 Max. 1.9 3.45 3.45 3.45 1.9 Unit V V V V V 1. VDDH, VOSC, VDDSD are also indicated in this document as VDD3. All others as VDD. Table 4. Symbol Rth j-amb Thermal data Parameter Thermal resistance junction to ambient Value 68 Unit C/W 8/39 TDA7580 Block diagram and electrical specifications 2.1 Pin description Figure 2. PIN connection (top view) DBOUT1 DBOUT0 VDDISO VDDSD DBRQ1 DBRQ0 DBCK1 DBCK0 GNDH GNDH DBIN1 DBIN0 VDDH VDDH GND VDD 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 VHI VCM VLO INP INN VCMOP GNDSD GNDOSC XTI XTO VDDOSC VDDMTR CKREFP CKREFN AGCKEY GNDMTR 49 1 2 3 48 47 46 45 44 43 42 GND VDD TST3_LRCKR TST2_SCKR LRCK_LRCKT SCLK_SCKT SDO0 VDDH GNDH TST1_SDI1 TST4_SDI0 GPIO_SDO1 TESTN GND VDD RESETN DEBUG1 IFADC DEBUG0 4 5 6 7 8 10 11 13 14 15 16 17 SAI OSC. Tuner 19 I 2 P/ CR /S D 20 PS 41 40 39 38 37 36 35 9 12 I D HS3I 21 22 23 24 25 26 27 28 RDS 29 30 31 INT S 34 33 32 ADDR_SD SDA_MOSI 18 RDS_INT IQCH1 IQCH2 IQCH3 MISO GND GNDH VDD VDDH PROTSEL_SS SCL_SCK IFADC Modulator Power Supply pins pair Oscillator Power Supply pins pair Tuner Clock Out and AGC Keying DAC Power Supply pins pair Core Logic 1.8V Power Supply pins pair I/O Ring 3.3V Power Supply pins pair Table 5. N Pin description Name Type Description Notes After Reset 1 VHI A It needs external Internally generated IFADC Opamps 2.65V (@VDD=3.3V) reference voltage pin minimum 4.7F ceramic for external filtering capacitor Internally generated common mode 1.65V It needs external (@VDD=3.3V) reference voltage pin for minimum 10F ceramic external filtering capacitor Internally generated IFADC opamps It needs external 0.65V (@VDD=3.3V) reference voltage pin minimum 4.7F ceramic for external filtering capacitor Positive IF signal input from tuner Negative IF signal input from tuner Not connected. 2.0Vpp @VDD=3.3V 2.0Vpp @VDD=3.3V 2 VCM A 3 4 5 6 VLO INP INN VCMOP A A A - RDS_CS IQSYNC 9/39 Block diagram and electrical specifications Table 5. N TDA7580 Pin description (continued) Name Type Description Notes Clean ground, to be star connected to voltage regulator ground Clean ground, to be star connected to voltage regulator ground Maximum voltage swing is VDD=3.3V After Reset 7 GNDSD G IFADC modulator analogue ground 8 GNDOSC G Oscillator ground High impedance oscillator input (quartz connection) or clock input when in Antenna Diversity slave mode Low impedance oscillator output (quartz connection) Oscillator power supply Tuner reference clock and AGC keying DAC power supply 9 XTI I 10 11 12 XTO VDDOSC VDDMTR O P P 3.3V 1.8V FM 100kHz AMEU 18kHz With internal pull-up, on at reset [PP] FM 100kHz AMEU 18kHz With internal pull-up, on at reset [PP] 1.5kohm 30% output impedance. 1Vpp 1% output dynamic range 13 CKREFP B Tuner reference clock positive output. Output 14 CKREFN B Tuner reference clock negative output. Output 15 AGCKEY A DAC output for Tuner AGC keying Ground of the tuner reference clock buffer and the AGC keying DAC DSP0 GPIO for control serial interface (low: SPI or high: I2C) selection at device Bootstrap. In SPI protocol mode, after boot procedure, SPI slave select, otherwise DSP0 GPIO0 Control serial interface and RDS IO: - SPI mode: slave data in or master data out for main SPI & RDS SPI data in - I2C mode: data for main I2C or RDS I2C SPI slave data out or master data in for main SPI and RDS SPI data out 16 GNDMTR G 17 PROTSEL_SS B DSP0 GPIO0 5V tolerant With internal pull-up, on at reset [PP] Input 18 SDA_MOSI B 5V tolerant With internal pull-up, on at reset [PP] DSP0 GPIO1 5V tolerant. With internal pull-up, on at reset [PP] 5V tolerant. With internal pull-up, on at reset [PP] Input 19 MISO B Input 20 SCL_SCK B Bit clock for Control Serial Interface and RDS Input 10/39 TDA7580 Table 5. N 21 22 GND VDD Block diagram and electrical specifications Pin description (continued) Name Type G P Description Digital core power ground Digital core power supply High speed synchronous serial interface (HS3I) clock if HS3I master mode, else DSP1 GPIO or DSP1 debug port clock (DBOUT1) High speed synchronous serial interface (HS3I) channel 1 data if HS3I master mode, else DSP1 GPIO or DSP1 debug port request (DBRQ1) High speed synchronous serial interface (HS3I) channel 2 data if HS3I master mode, else DSP1 GPIO or DSP1 debug port data In (DBIN1) High speed synchronous serial interface (HS3I) channel 3 data if HS3I master mode, else DSP1 GPIO or DSP1 debug port data out (DBCK1) 3.3V IO ring power supply (HS3I, I2C/SPI, RDS, INT) 3.3V IO ring power ground (HS3I, I2C/SPI, RDS, INT) RDS interrupt to external main microprocessor in case of traffic information DSP1 GPIO4. 5V tolerant, open drain With internal pull-up, on at reset [OD] 1.8V DSP1 GPIO0 5V tolerant. With internal pull-up, on at reset DSP1 GPIO1 5V tolerant. With internal pull-up, on at reset [PP] DSP1 GPIO2 5V tolerant. With internal pull-down, on at reset [PP] DSP1 GPIO3 5V tolerant With internal pull-down, on at reset [PP] Notes After Reset 23 IQSYNC B Input 24 IQCH1 B Input 25 IQCH2 B Input 26 IQCH3 B Input 27 28 VDDH GNDH P G 29 RDS_INT B Input 30 RDS_CS B RDS chip select. When RESETN rising, If DSP1 GPIO5. 5V RDS_CS 0, the RDS's SPI is selected; tolerant. With internal else RDS's I2C pull-up, on at reset [PP] DSP0 external interrupt IFS chip master (Low) or slave (High) mode selection, latched in upon RESETN release. It selects the LSB of the I2C addresses. Station detector output Chip hardware reset, active low Digital power supply Digital power ground Test enable pin, active low With internal pull-up 5V tolerant. With internal pull-up, on at reset DSP0 GPIO2 5V tolerant With internal pull-down, on at reset [PP] 5V tolerant With internal pull-up 1.8V Input 31 INT I 32 ADDR_SD B Input 33 34 35 36 RESETN VDD GND TESTN I P G I 11/39 Block diagram and electrical specifications Table 5. N TDA7580 Pin description (continued) Name Type Description DSP0 GPIO for boot selection or audio SAI0 output. Notes 5V tolerant. DSP0 GPIO3. With internal pull-up, on at reset [PP] After Reset Input 37 GPIO_SDO1 B 38 TST4_SDI0 B 5V tolerant. DSP0 Audio SAI0 data input or test selection pin GPIO5. With internal in test mode pull-up, on at reset [PP] DSP0 GPIO for boot selection or audio SAI1 input. Test selection pin in test mode. 3.3V IO ring power ground (audio SAI, ResetN, test pins) 3.3V IO ring power supply (audio SAI, ResetN, test pins) Radio or audio SAI0 data output SAI0 receive and transmit bit clock (master or slave with ASRC); SAI1 transmit bit clock SAI0 receive and transmit left/right clock (master or slave with ASRC); SAI1 transmit left/right clock SAI0 Transmit bit clock; SAI1 receive and transmit bit clock. Or test selection pin in test mode SAI0 Transmit LeftRight clock; SAI1 Receive and Transmit bit clock. Or Test selection pin in Test Mode Digital core power supply Digital core power ground DSP0 GPIO. 9. 5V tolerant. With internal pull down, on at reset [PP] DSP0 GPIO. 11. 5V tolerant. With internal pull down, on at reset [PP] DSP0 GPIO. 5V tolerant With internal pull up, on at reset [PP] DSP0 GPIO10. 5V tolerant. With internal pull up, on at reset [PP] 5V tolerant. With internal pull up, @0V at reset [PP] 5V tolerant With internal pull up, on at reset [PP] 5V tolerant With internal pull up, on at reset [PP] 5V tolerant. DSP0 GPIO6. With internal pull up, on at reset [PP] DSP0 GPIO7. 5V tolerant. With internal pull up, on at reset [PP] 1.8V 5V tolerant. DSP0 GPIO4. With internal pull-up, on at reset [PP] Input 39 TST1_SDI1 B Input 40 41 GNDH VDDH G P 42 SDO0 B Output 43 SCLK_SCKT B Input 44 LRCK_LRCKT B Input 45 TST2_SCKR B Input 46 47 48 TST3_LRCKR VDD GND B P G Input 49 DBCK0 B Debug port clock of DSP0 (DBCK0) Input 50 DBIN0 B Debug port data input of DSP0 (DBIN0) Input 51 DBRQ0 B Debug port request of DSP0 (DBRQ0) Input 52 DBOUT0 B Debug port data output of DSP0 (DBOUT0) Input 12/39 TDA7580 Table 5. N 53 54 GNDH VDDH Block diagram and electrical specifications Pin description (continued) Name Type G P Description 3.3V IO ring power ground (debug interface, GPIO) 3.3V IO ring power supply (Debug interface, GPIO) DSP1 debug port clock (DBCK1) if HS3I master mode, else high speed synchronous serial interface (HS3I) channel3 data DSP1 GPIO or DSP1 debug port data in (DBIN1) if HS3I master mode, else high speed synchronous serial interface (HS3I) channel2 data i DSP1 GPIO9. 5V tolerant. With internal pull down, on at reset [PP] DSP1 GPIO11 5V tolerant With internal pull down, on at reset [PP] Notes After Reset 55 DBCK1 B Input 56 DBIN1 B Input 57 DBRQ1 B DSP1 GPIO or DSP1 debug port request 5V tolerant. With (DBRQ1) if HS3I master mode, else high internal pull up, on at speed synchronous serial interface (HS3I) reset [PP] channel1 data DSP1 GPIO or DSP1 debug port data out (DBOUT1) if HS3I master mode, else high speed synchronous serial interface (HS3I) clock Digital core power supply Digital core power ground 3.3V N-isolation biasing supply 3.3V IO ring power ground (modulator digital section) 3.3V IO ring power supply (modulator digital section) 3.3V IFADC modulator analogue power supply Clean power supply, to be star connected to 3.3V voltage regulator Clean 3.3V supply to be star connected to voltage regulator DSP1 GPIO10 5V tolerant With internal pull up, on at reset [PP] 1.8V Input 58 DBOUT1 B Input 59 60 61 VDD GND VDDISO P G P 62 63 GNDH VDDH G P 64 VDDSD P I/O Type P: Power supply from voltage regulator G: Power ground from voltage regulator A: Analogue I/O I: Digital input O: Digital output B: Bidirectional I/O I/O Definition and status Z: high impedance (input) O: logic low output X: undefined output 1: logic high output Output PP: Push pull / OD: Open drain 13/39 Block diagram and electrical specifications TDA7580 2.2 Table 6. Symbol lilh lihh lil lih Iipdh Iopuh Iopul Iaihop Electrical characteristics General interface electrical characteristics (Tj =-40C to 125C; VDD=1.8V, VDD3= 3.3V) Parameter Low level input current I/Os@VDD3 (absolute value) High level input current I/Os@VDD3 (absolute value) Low level input current I/Os@VDD (absolute value) High level input current I/Os@VDD (absolute value) Pull-down current I/Os @ VDD3 Pull-up current I/Os @ VDD3 Pull-up current I/Os @ VDD Test condition Vi = 0V (1) (2) without pull-up-down device Vi = VDD3 (1) (2) without pull-up-down device Vi = 0V (1) (3) (4) without pull-up-down device Vi = VDD (1) (3) (4) without pull-up device Vi = VDD3 (5) with pull-down device Vi = 0V (6) with pull-up device Vi = 0V (3) with Min. Typ. Max. 1 1 1 1 Unit A A A A A A A mA mA mA mA mA mA A A A mA A A A A mA V 35 -100 -40 0.95 -6.25 6.0 -10.0 3.75 60 -70 -30 1.25 -5.0 8.0 -8.0 5.0 85 -40 -20 1.55 -3.75 10.0 -6.0 6.25 pull-up device Analogue pin sunk / drawn current Vi = VDD3 on pin1 Vi = 0V Analogue pin sunk / drawn current Vi = VDD3 on pin 2 Vi = 0V Analogue pin sunk / drawn current Vi = VDD3 on pin 3 Vi = 0V Analogue pin sunk / drawn current Vi = VDD3 on pin 4 and pin 5 Vi = 0V Analogue pin current on pin 6 Vo = 0V or VDD3 Iacm Iail -1.55 -1.25 -0.95 24 -40 32 -32 40 -24 5 0.8 1.2 1.6 1 1 1 80 200 2000 Iain Iaih6 Iaik Ioz IozFT Ilatchup Vesd Analogue pin sunk / drawn current Vi = VDD on pin 15 Vi = 0V (spec absolute value) Tri-state output leakage 5V tolerant tri-state output leakage I/O latch up current Electrostatic protection Vo = 0V or VDD3 without pull up / down device (1) Vo = 0V or VDD (1) Vo = 5V V < 0V, V > VDD Leakage, 1A 1. The leakage currents are generally very small, <1nA. The value given here, 1mA, is the maximum that can occur after an electrostatic stress on the pin. 2. On pins: 17 to 20, 23 to 26, 29 to 33, 36 to 39, 42 to 46, 49 to 52, 55 to 58. 3. On pins: 13 and 14. 4. Same check on the analogue pin 15 (physically without pull-up-down) 5. On pins: 25, 26, 32, 49, 50, 55, 56 6. On pins: 17 to 20, 23 to 24, 29 to 31, 33, 36 to 39, 42 to 46, 51, 52, 57, 58 14/39 TDA7580 Table 7. Symbol Vil Vih Vol Voh Block diagram and electrical specifications Low voltage interface CMOS DC electrical characteristics (Tj =-40C to 125C; VDD3= 3.3V) Parameter Low level input voltage High level input voltage Low level output voltage High level output voltage Test condition 1.70V<=VDD<=1.90V 1.70V<=VDD<=1.90V Iol = 4mA (1) Min. Typ. Max. 0.2*VDD Unit V V 0.8*VDD 0.15 VDD-0,15 V V Iol = -4mA (1) 1. It is the source/sink current under worst case conditions and reflects the name of the I/O cell according to the drive capability. Table 8. Symbol Vil Vih Vol Voh High voltage CMOS interface DC electrical characteristics (Tj =-40C to 125C; VDD=1.8V) Parameter Low level input voltage High level input voltage Low level output voltage High level output voltage Test condition 3.15V<=VDD3<=3.45V 3.15V<=VDD3<=3.45V Iol = XmA (1) (2) (1) (2) Min. Typ. Max. 0.8 Unit V V 2.0 0.15 VDD3-0.15 V V Iol = -XmA 1. It is the source/sink current under worst case conditions & reflects the name of the I/O cell according to the drive capability 2. X=4mA for pins 17 to 20, 29, 30, 32, 37 to 39, 42 to 46; X=8mA for pins 23 to 26, 49 to 52, 55 to 58. Table 9. Symbol IDD IDDHdc IDDHac ISD IOSCdc IOSCac IMTR Current consumption (Tj =-40C to 125C) Parameter Current through VDD power supply Static current through VDDH power supply Current through VDDH power supply Current through VSD power supply Current through VOSC power supply Current through VOSC power supply Current through VMTR power supply Test condition VDD=1.8V,VDD3=3.3V All digital blocks working VDD=1.8V,VDD3=3.3V VDD=1.8V,VDD3=3.3V I/Os working with 5pF load VDD=1.8V,VDD3=3.3V VDD=1.8V,VDD3=3.3V without quartz VDD=1.8V,VDD3=3.3V with quartz VDD=1.8V,VDD3=3.3V 25 5.5 6.5 0.5 35 8 9 1.3 10 Min. Typ. 120 13 Max. 150 16 50 45 10.5 11.5 2.0 Unit mA mA mA mA mA mA mA Note: 74.1MHz internal DSP clock, at Tamb = 25C. Current due to external loads not included. 15/39 Block diagram and electrical specifications Table 10. Symbol FOSCFM TDA7580 Oscillator characteristics (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V) Parameter Oscillator frequency (XTI/XTO) Test condition Min. Typ. 74.1 Max. Unit MHz Note: The accuracy depends on the quartz frequency precision: high stability oscillator Table 11. Crystal characteristics for 1 and 2 chip load Parameter value Parameter name 1 chip load Temperature range Adjustment tolerance (@ 25C 3C) Frequency stability (-20C/+70C) Aging @ 25C Shunt (static) capacitance [Co] Motional capacitance Mode of oscillation Resonance resistance Capacitive load for oscillation frequency = 74.1MHz -55C/125C 30 ppm 50 ppm 5 ppm/year <5pF 1fF 30% AT-3rd < 75 ohm 10pF 2 chips load -55C/125C 30 ppm 50 ppm 5 ppm/year <5pF 1fF 30% AT-3rd < 45 ohm 12pF Table 12. External clock signal on XTI (In case the device is driven by an external clock through the XTI pin, the characteristics reported in this table have to be met) Parameter value Parameter name Min Clock frequency Typ 74.10 -50 50 10 5 220 0.50 45 (1) Max Unit MHz ppm ps rms ms mV rms V p-p % ps Frequency stability (-20C/+70C) Clock jitter Start up time Clock level (sine wave) (1) Clock level (square wave) (1) 640 1.80 55 500 Clock duty cycle (square wave) Clock rise / fall time (square wave) 1. specified @ XTI pin of TDA7580 16/39 TDA7580 Table 13. Symbol FdspMax Block diagram and electrical specifications DSP core (Tj =-40C to 125C) Parameter Maximum DSP clock frequency Test condition VDD=1.7V, VDD3= 3.3V Min. 81.5 Typ. Max. Unit MHz Table 14. FM stereo decoder characteristics (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V; BW for measurements 20Hz to 15KHz) Parameter Channel separation Total harmonic distortion Test condition (Adjustble by SW from 0 to -45dB) 1KHz; mono; f=75KHz; 1KHz; mono; f=40KHz; 78 Min. -45 0.02 80 Typ. Max. 0 0.04 82 Unit dB % dB Symbol a_ch THD (S+N)/N Signal plus noise to noise ratio MCK = 18.525MHz, Fsin/Fsout = 0.820445366 Table 15. Sample rate converter (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V); BW for measurements 20Hz to 20KHz Parameter Test condition 20Hz to 20kHz, full scale, 16 bit inp. 20Hz to 20kHz, full scale, 20 bit inp. 1 kHz full scale, 16 bit inp. 2 kHz full scale, 16 bit inp. 5 kHz full scale, 16 bit inp. 10 kHz full scale, 16 bit inp THD+N Total harmonic distortion + noise 15 kHz full scale, 16 bit inp 1 kHz full scale, 20 bit inp. 2 kHz full scale, 20 bit inp. 5 kHz full scale, 20 bit inp. 10 kHz full scale, 20 bit inp 15 kHz full scale, 20 bit inp Dynamic Range DR fratio = 0.82 Rp Fratio Pass band ripple Sampling frequency in/out ratio 1 kHz -60 dB - 24 bit inp. A-weighted from 20Hz to 15kHz Fsout = 44.1 kHz 0.7 141 145 0.4 0.5 1.13 dB dB 1 kHz -60 dB - 16 bit inp. A-weighted 97 -98 -119 -116 -112 -108 -105 100 -95 -116 -113 -109 -105 -102 dB dB dB dB dB dB dB Min. Typ. -95 -98 -98 -98 -98 -98 Max. -92 -95 -95 -95 -95 -95 Unit dB dB dB dB dB dB Symbol 17/39 Block diagram and electrical specifications Figure 3. Power on and boot sequence using I2C TDA7580 VDD3 VDD INT RESETN ADDR_SD PROTSEL_SS RDS_CS GPIO_SDO1 TST1_SDI1 SDA_MOSI tint tvdd3 tvdd I2C/SPI SLAVE=1 I2C/SPI MASTER=0 IFS SLAVE=1 IFS MASTER=0 Boot RDS init SW download Tuner data Data trhd trsu treson tseq tsw tdat ttun Figure 4. Power on and boot sequence using SPI VDD3 VDD INT RESETN ADDR_SD PROTSEL_SS RDS_CS GPIO_SDO1 TST1_SDI1 SDA_MOSI tint tvdd3 tvdd I2C/SPI SLAVE=1 I2C/SPI MASTER=0 IFS SLAVE=1 IFS MASTER=0 Boot RDS init SW download Tuner data Data trhd trsu treson tseq tsw tdat ttun 18/39 TDA7580 Table 16. Timing tvdd3 tvdd tint treson trsu trhd tseq tsw ttun tdat Rise time of 3.3V supply Rise time of 1.8V supply Maximux delay for INT signal Block diagram and electrical specifications SPI and I2C timing table (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V) Description Min 1 1 40 250 250 4 30 1 1 Typ 13 6 Max 25 10 1 Unit ms ms ms ms s s ms s s s Minimum RESETN hold time at 0 after the start-up Minimum data set-up time Minimum data hold time Minimum wait time including boot Minimum wait time before downloading the program software Minimum wait time before downloading the software to the FE Minimum wait time before using interface protocols 19/39 SAI Interface TDA7580 3 SAI Interface Figure 5. SAI Timings SDI0-1 Valid LRCKR Valid SCKR (RCKP=0) tlrs tdt tsckpl tsdis tlrh tsdih tsckph tsckr Table 17. SAI Timing table (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V) Cload The values on the table are consistent with a capacitance load on SAI lines of 160pF Description Clock Cycle SCKR active edge to data out valid LRCK setup time LRCK hold time SDI setup time SDI hold time SCK high time SCK low time Min 302 48 25 25 65 65 146 146 Typ Max 976 65 Unit ns ns ns ns ns ns ns ns Timing tsckr tdt tlrs tlrh tsdis tsdih tsckph tsckpl Note: TDSP = DSP master clock cycle time = 1/FDSP Figure 6. SAI protocol (when: RLRS=0; RREL=0; RCKP=1; RDIR=0) LRCKR SCKR LEFT RIGHT SDI0-1 LSB(n-1) MSB(n) MSB-1(n) MSB-2(n) 20/39 TDA7580 Figure 7. SAI protocol (when: RLRS=1; RREL=0; RCKP=1; RDIR=1) SAI Interface LRCKR SCKR LEFT RIGHT SDI0-1 MSB(n-1) LSB(n) LSB+1(n) LSB+2(n) Figure 8. SAI protocol (when: RLRS=0; RREL=0; RCKP=0; RDIR=0) LRCKR SCKR LEFT RIGHT SDI0-1 LSB(n-1) MSB(n) MSB-1(n) MSB-2(n) Figure 9. SAI protocol (when: RLRS=0; RREL=1; RCKP=1; RDIR=0) LRCKR SCKR LEFT RIGHT SDI0-1 LSB(n-1) MSB(n) MSB-1(n) MSB-2(n) 21/39 RDS SPI interface TDA7580 4 RDS SPI interface Figure 10. RDS SPI timings SS MISO MOSI Valid SCL (CPOL=0,CPHA=0) tdtr tsetup tsssetup tsclkl thold tsshold tssw tsclkh tsclk Table 18. RDS SPI timing table (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V) Cload The values on the table are consistent with a capacitance load on RDS SPI lines of 80pF Description Slave configured Min Typ Max Unit Symbol tsclk tdtr tsetup thold tsclkh tsclkl tsssetup tsshold tssw Clock cycle Sclk edge to MISO valid MOSI setup time MOSI hold time SCK high time width SCK low time width SS setup time SS hold time SS pulse width 1240 239 255 365 620 620 620 620 1240 365 ns ns ns ns ns ns ns ns ns 22/39 TDA7580 Figure 11. RDS SPI clocking scheme RDS SPI interface SS(#17) (CPOL=0,CPHA=0) SCK(#20) SCK(#20) SCK(#20) (CPOL=0,CPHA=1) (CPOL=1,CPHA=0) SCK(#20) (CPOL=1,CPHA=1) MISO(#19) MOSI(#18) MSB 6 5 4 3 2 1 0 23/39 BSPI interface TDA7580 5 BSPI interface (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V) Cload The values on the table are consistent with a capacitance load on BSPI lines of 160pF) Figure 12. BSPI timings SS MISO MOSI Valid SCL (CPOL=0,CPHA=0) tdtr tsetup tsssetup tsclkl thold tsshold tssw tsclkh tsclk Table 19. Symbol BSPI timing table Description Min Typ Max Unit Master configured tsclk tdtr tsetup thold tsclkh tsclkl tsssetup tsshold tssw Clock cycle Sclk edge to MOSI valid MISO setup time MISO hold time SCK high time SCK low time SS setup time SS hold time SS pulse width 184 61 52 52 92 92 92 92 184 92 ns ns ns ns ns ns ns ns ns Slave configured tsclk tdtr tsetup thold tsclkh tsclkl tsssetup tsshold tssw Clock cycle Sclk edge to MISO valid MOSI setup time MOSI hold time SCK high time SCK high low SS setup time SS hold time SS pulse width 238 88 65 65 119 119 119 119 238 119 ns ns ns ns ns ns ns ns ns 24/39 TDA7580 Figure 13. BSPI clocking scheme BSPI interface SS(#17) (CPOL=0,CPHA=0) SCK(#20) SCK(#20) SCK(#20) (CPOL=0,CPHA=1) (CPOL=1,CPHA=0) SCK(#20) (CPOL=1,CPHA=1) MISO(#19) MOSI(#18) MSB 6 5 4 3 2 1 0 25/39 Inter processor transport interface for antenna diversity TDA7580 6 Inter processor transport interface for antenna diversity (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V) Cload. The values on the table are consistent with a capacitance load on HS3I lines of 20pF Figure 14. High speed synchronous serial interface - HS3I Master Bit Clock Master Data Out M2 M3 256 cycles of 74.1MHz Master Synch Slave Data Out S0 S1 S2 S3 Figure 15. HS3I clocking scheme tmbco tmbcs tsdos Master Bit Clock tmbcc Master Data Out Master Synch Slave Data Out Table 20. Timing tsclk tdtr tsetup thold HS3I timing table Description MBC clock cycle MBC active edge to master data out valid MBC active edge to master synch valid Slave data out setup time Min 107.95 4 4 6 Typ Max 107.97 Unit ns ns ns ns Note: TDSP = DSP master clock cycle time = 1/FDSP 26/39 TDA7580 I2C timing 7 I2C timing Figure 16. DSP and RDS I2C BUS timings Table 21. I2C BUS timing table (Tj =-40C to 125C; VDD =1.7V to 1.9V, VDD3 = 3.15V to 3.45V) Parameter Test condition Standard mode I2C BUS Min. Max. 100 - Fast mode I2C BUS Min. 0 1300 Max. 400 - kHz ns Unit Symbol FSCL tBUF SCLl clock frequency Bus free between a stop and start condition Hold time (repeated) START condition. After this period, the first clock pulse is generated LOW period of the SCL clock HIGH period of the SCL clock Set-up time for a repeated start condition DATA hold time Rise time of both SDA and SCL signals Fall time of both SDA and SCL signals Set-up time for STOP condition Data set-up time Capacitive load for each bus line Cb in pF Cb in pF 0 4800 tHD:STA tLOW tHIGH tSU:STA tHD:DAT tR tF tSU;STO tSU:DAT Cb 4800 4800 4800 4800 0 - - 4800 250 10 - - - - 300 300 - - 400 600 1300 600 600 0 12+0.1Cb 12+0.1Cb 600 250 10 - - - - 900 300 300 - - 400 ns ns ns ns ns ns ns ns ns pF 27/39 Functional description TDA7580 8 Functional description The TDA7580 IC offers a solution for high performance FM/AM car radio receivers. The high processing power allows audio processing of both internal and external audio source. The processing engine is based on a 24bit programmable DSP, with separate banks of program and data RAMs. A number of hardware modules (peripherals) help in the algorithm implementation of channel equalization and FM/AM baseband post processing. The HW architecture allows to perform dual tuner diversity. In this case two TDA7580 are needed: one device must be configurated as master, generates the clock and controls the main data interfaces. The second device becomes the slave and converts the second IF path, as well as helps the first chip as co-processor. 8.1 24 bit DSP core Some capabilities of the DSP are listed below: Single cycle multiply and accumulate with convergent rounding and condition code generation 24 x 24 to 56-bit MAC Unit Double precision multiply Scaling and saturation arithmetic 48-bit or 2 x 24-bit parallel moves 64 interrupt vector locations Fast or long interrupts possible Programmable interrupt priorities and masking Repeat instruction and zero overhead DO loops Hardware stack capable of nesting combinations of 7 DO loops or 15 interrupts / subroutines Bit manipulation instructions possible on all registers and memory locations, also jump on bit test 4 pin serial debug interface Debug access to all internal registers, buses and memory locations 5 word deep program address history FIFO Hardware and software breakpoints for both program and data memory accesses Debug single stepping, instruction injection and disassembly of program memory 28/39 TDA7580 Functional description 8.2 DSP peripherals Clock generation unit (CGU) Stereo decoder (HWSTER) Serial audio interface (SAI) Tuner AGC keying DAC (KEYDAC) Programmable I/O interface (I2C/BSPI) Asynchronous sample rate converter (ASRC) IF band pass sigma delta modulator (IFADC) Digital down converter (DDC) Discriminator (CORDIC) RDS Tuner diversity HS3I The peripherals are mapped in the X memory space. Most of them can be handled by interrupt, with software programmable priority. Peripherals running at very high rate have direct access to X and Y data bus for very fast movement from or to the core, by mean of single cycle instruction. 8.3 Clock generation unit (CGU) and oscillator This unit is responsible for supplying all necessary clocks and synchronization signals to the whole chip. The control status register of this unit contains information about the current working mode (oscillator [master mode] or clock buffer [slave mode]), the tuner clock frequency setting, the general setup of the oscillator. This last function is performed inside the CGU, that establishes using a self trimming algorithm, which is the current values that can bias the oscillator: this feature lets the oscillator be independent from process parameters variation. The values of bias current are stored in the control status register of the CGU: 4 bits for the coarse current steps and 6 bits for the fine current steps. In slave mode the oscillator behaves as a buffer: the chip can be then driven using an external clock. The clock divider, placed in this unit, generates the tuner the reference clock and can be programmed for frequencies down to 9KHz with selectable duty cycle and from 4.4Hz to 9KHz with duty cycle 50%. An external clock can drive the XTI pin (please see Table 12 for reference). 8.4 Stereo decoder (HWSTER) The fully digital hardware stereo decoder does all the signal processing necessary to demodulate an FM MPX signal which is prepared by the channel equalization algorithm in the digital IF sampling device, providing pilot tone dependent mono/stereo switching, as well as stereo-blend and highcut functionality. Selectable de-emphasis time constant allow the use of this module for different FM radio receiver standards. 29/39 Functional description TDA7580 There are built in filters for field strength processing. In order to obtain the maximum flexibility the field strength processing and noise cancellation, however, are implemented as software inside the programming DSP, which has to provide control signals for the stages softmute, stereoblend, and highcut. 8.5 Serial audio interface (SAI) The two SAI modules have been embedded in such a way great flexibility is available in their use. The two modules are fully separate and they each have a receive and a transmit channel, as well as they can be selected as either master or slave. The bit clocks and left & right clocks are routed through the pins, so the audio interface can be chosen to be adapted to a large variety of application. One SAI transmit channel can have the asynchronous sample rate converter in front, thus separate different audio rate domains. Additional feature are: support of 16/24/32 bit word length programmable left/right clock polarity programmable rising/falling edge of the bit clock for data valid programmable data shift direction, MSB or LSB received / transmitted first 8.6 I2C interfaces The inter integrated circuit bus is a single bidirectional two wire bus used for efficient inter IC control. All I2C bus compatible devices incorporate an on-chip interface which allows them communicate directly with each other via the I2C bus. Every component hooked up to the I2C bus has its own unique address whether it is a CPU, memory or some other complex function chip. Each of these chips can act as a receiver and /or transmitter on its functionality. Two pins are used to interface both I2C of the DSP and RDS, which have different internal I2C address, thus reducing the on board pin interconnections. 8.7 Serial peripheral interfaces The DSP and RDS can have this serial interface, alternative to the I2C one. DSP and RDS SPI modules have separate pin for chip select. The DSP SPI has a ten 24 bit words deep FIFO for both receive and transmit sections, which reduces DSP processing overhead even at high data rate. The serial interface is needed to exchange commands and data over the LAN. During an SPI transfer, data is transmitted and received simultaneously. A serial clock line synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows individual selection of a slave SPI device. When an SPI transfer occurs an 8-bit word is shifted out one data pin while another 8-bit character is simultaneously shifted in a second data pin. The central element in the SPI 30/39 TDA7580 Functional description system is the shift register and the read data buffer. The system is single buffered in the transfer direction and double buffered in the receive direction. 8.8 High speed serial synchronous interface (HS3I) The high speed serial synchronous interface is a module to send and receive data at high rate (up to 9.25Mbit/s per channel) in order to exchange data between 2 separate TDA7580 chip. The exchanged data are related to signals that are used to increase reception quality in car radio systems, which make use of antenna diversity based upon two separate antenna and tuner sections. The channel synchronization clock has a programmable duty cycle, so to reduce in band harmonics noise. 8.9 Tuner AGC keying DAC (KEYDAC) This DAC provides the front-end tuner with an analogue signal to be used to control the automatic gain controlled stage, thus giving all time the best voltage dynamic range at the IFADC input. 8.10 Asynchronous sample rate converter (ASRC) This hardware module provides a very flexible way to adapt the internal audio rate, to the one of an external source. It does not require further work off the DSP. There is no need to explicitly configure the input and the output sample rates, as the ASRC solves this problem with an automatic digital ratio locked loop. Main features are: Automatic tracking of sample frequency Fully digital ratio locked loop Sampling clock jitter rejection Up conversion up to 1:2 Ratio Linear phase 8.11 IF band pass analogue to digital converter (IFADC) The IFADC is a band pass Sigma Delta A to D converter with sampling rate of 37.05MHz (nominal) and notch frequency of 10.7MHz. The structure is a second order switched capacitor multi bit modulator with self calibration algorithm to adjust the notch frequency. The differential ended input allows 4.0Vpp voltage dynamic range, and reduces the inferred noise back to the previous stage (tuner), and in turn gives high rejection to common mode noises. The high linearity (very high IMD) is needed to fulfill good response of the channel equalization algorithm. Low thermal and 1/f noise assures high dynamic range. 31/39 Functional description TDA7580 8.12 Digital down converter (DDC) The DDC module allows to evaluate the in-phase and quadrature components of the incoming digital IF signal. The I and Q computation is performed by the DDC block, which at the same time shifts down to 0-IF frequency the incoming digital signal. After the down conversion the rate is still very high (at the 37.05MHz rate); a SincK filter samples data down by a factor of 32, decreasing it to 1.1578MHz. An additional decimation is performed by the subsequent FIR filters, thus lowering the data rate at the final 289.45kHz, being the MPX data rate. 8.13 RDS The RDS block is an hardware cell able to process RDS/RBDS signal, intended for recovering the inaudible RDS/RBDS information which are transmitted by most of FM radio broadcasting stations. It comprises of the following: Demodulation of the european radio data system (RDS) Demodulation of the US radio broadcast data system (RDBS) Automatic group and block synchronisation with flywheel mechanism Error detection and correction RAM buffer with a storage capacity of 24 RDS blocks and related status information I2C and SPI interface, with pins shared with the DSP I2C/SPI After filtering the oversampled MPX signal, the RDS/RDBS demodulator extracts the RDS data clock, RDS data signal and the quality information. The following RDS/RBDS decoder synchronizes the bitwise RDS stream to a group and block wise information. This processing also includes error detection and error correction algorithms. In addition, an automatic flywheel control avoids exhausting the data exchange between RDS/RDBS processor and the host. 8.14 AM/FM Detector (CORDIC) The AM/FM detector is a fully programmable peripheral used to detect the phase, amplitude and frequency information of an input complex signal (in-phase and quadrature signals). It can be used to demodulate PM, AM and FM modulated signals. The detection is performed using a high accuracy CORDIC algorithm, working essentially as a cartesian to polar transformer. Four CORDICs are available to allow concurrent software calls. 32/39 TDA7580 Application diagrams 9 Application diagrams Figure 17. Radio mode with external slave audio DAC 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 1 2 3 4 5 6 7 8 9 TST3_LRCKR TST2_SCKR LRCK_LRCKT SCLK_SCKT SDO0 49 48 47 46 45 44 43 42 41 40 1 8 7 6 5 TDA7580 Fs=36kHz 2 3 4 10 11 12 13 14 15 17 18 19 20 21 22 23 24 25 26 27 28 16 TST1_SDI1 39 TST4_SDI0 38 GPIO_SDO1 37 36 35 34 33 29 30 31 32 TDA7535 Dual DAC In this mode an external slave stereo DAC, like the ST TDA7535, can be easily connected and the TDA7580 outputs the audio from radio station at 36kHz rate. Figure 18. Radio mode with external master audio device 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 1 2 3 4 5 6 7 8 9 TST3_LRCKR 46 TST2_SCKR LRCK_LRCKT SCLK_SCKT SDO0 45 44 43 42 41 40 1 2 3 49 48 47 TDA7580 Fs 4 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 TST1_SDI1 39 TST4_SDI0 38 GPIO_SDO1 37 36 35 34 33 29 30 31 32 External Audio Receiver with its owned audio rate Fs An external digital audio device is connected externally as a digital audio master, and the internal TDA7580 sample rate converter is responsible for the conversion from internal 36kHz to the external audio rate. 33/39 Application diagrams Figure 19. Audio mode with external slave audio device 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 TDA7580 1 2 3 4 5 6 7 8 9 48 47 TST3_LRCKR 46 TST2_SCKR LRCK_LRCKT SCLK_SCKT SDO0 45 44 43 42 41 40 1 2 3 4 1 2 3 4 CD Player Fs=44.1kHz 8 7 6 5 8 7 6 5 TDA7580 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 TST1_SDI1 39 TST4_SDI0 38 GPIO_SDO1 37 36 35 34 33 28 29 30 31 32 Fs=44.1kHz TDA7535 Analog In ADC The 2 stereo channel serial audio interface of the TDA7580 chip allows a very flexible application in which external audio source/sinks can be connected. The example shows an external CD player digital output giving the main Fs audio rate of the whole system. This rate is also the one of the external DACs and an ADC, being configured as slave. 34/39 9.1 Note: VHI 1 2 VCM TDA7580 RO = 01KW To prevent Electromagnetic injection 46 ADDITIONAL GPIO 10K(*) VDDH 10K(*) VDDH RO FSYNC 13 220nF TST3_LRCKR DBRQ1 DBRQ0 RO VLO 3 6 VCMOP 4.7 m F 57 51 4.7 m F GNDSD 7 44 LRCK0_LRCKT 10nF INP 4 10 m F 4.7 m F 12 VCM VDDD 31 43 42 GNDD 5 6 SDOUT_SDO0 2 IFOUT1 SCLK0_SCKT SCK 3 RO RO SDATA 220nF 30 470 IFOUT2 5 10nF 9 INM CKREFP 13 26 15pF (*) Frel+ TDA7535 SO14 8 OUTSL L_Radio F 10m 25 Frel14 470 CKREFN 59 VDD 10F 60 GND VDDA VDDA 10 VDD GNDA TDA7515 15 220pF 28 GNDMTR 16 DAGC 470 AGCKEY 14 7 OUTSR R_Audio 33 RESETN 470nF RSTN 23 22pF I2C BUS SDA SDA 18 470 SDA_MOSI TDA7580 TQFP64 54 GNDH VDD 10F 48 GND 41 VDDH VDDH VDDH 100nF Electrical application scheme Figure 20. Application diagram example SCL 20 22 22pF VDD SCL SCL_SCK 470 53 47 VDD VDD 22 10F GND 21 VDDH 100nF VDDH 30 11 VDDA RDS_CS VDDOSC 40 GNDH (*) OPTIONAL 470nF GNDOSC 8 9 10 12 29 31 INT 37 36 34 GPIO_SDO1 TESTN VDD VDA and VDD = 1.8V VDDA and VDDH = 3.3V XTI 5.6pF (**) 10pF 180R XTO VDDMTR VDDH VDD (**) 10F 35 GND VDA RANGE 5.6pF TO 10pF 470nF DEPENDING ON BOARD PARASITICS 32 27 VDDH 28 GNDH 100nF 63 VDDH GNDH 100nF 62 VDDSD 64 61 VDDISO RDS_INT DSP_INTERRUPT ADDR_SD RDS_INTERRUPT {put pull-up on board} The following application diagram is only an example. For real application setup, it is necessary to refer to the application notes. VCMOP capacitor (4.7uF) is only needed for CA silicon. This is needed to be consistent with "pin description " in Table 6 VDDH MASTER/SLAVE SELECTION (STATION DETECTOR AFTER RESET) VDDH VDDH Application diagrams 35/39 Package marking TDA7580 10 Package marking Figure 21. Package marking 36/39 TDA7580 Package information 11 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 22. Mechanical, data and package dimensions mm DIM. MIN. A A1 A2 B C D D1 D3 e E E1 E3 L L1 K ccc 0.45 11.80 9.80 0.05 1.35 0.17 0.09 11.80 9.80 12.00 10.00 7.50 0.50 12.00 10.00 7.50 0.60 1.00 0.75 12.20 10.20 0.464 0.386 1.40 0.22 TYP. MAX. 1.60 0.15 1.45 0.27 0.20 12.20 10.20 0.002 0.053 0.055 MIN. TYP. MAX. 0.063 0.006 0.057 inch OUTLINE AND MECHANICAL DATA 0.0066 0.0086 0.0106 0.0035 0.464 0.386 0.472 0.394 0.295 0.0197 0.472 0.394 0.295 0.0177 0.0236 0.0295 0.0393 0.480 0.401 0.0079 0.480 0.401 0 (min.), 3.5 (min.), 7(max.) 0.080 0.0031 LQFP64 (10 x 10 x 1.4mm) D D1 A D3 A1 48 49 33 32 0.08mm ccc Seating Plane A2 B E3 E1 64 1 e 16 17 C L1 E L K TQFP64 B 0051434 F 37/39 Revision history TDA7580 12 Revision history Table 22. Date 24-Jan-06 01-Jun-04 Document revision history Revision 1 2 Initial release. Changed the style look following the "Corporate technical publications design guide. Changed the maturity from product preview to final. Included legend for I/O definition. Included separated specification for the 2 SPI (BSPI and RDS-SPI). Upgraded all tables with temperature range and electrical / timing parameters. Changed description of PIN 6 in PIN description table. Added new sub section titled AM/FM Detector (CORDIC). Updated all tables. Package changed, layout and text modifications Changes 01-Dec-04 3 01-Jan-06 09-Mar-07 4 5 38/39 TDA7580 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 39/39 |
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